アメリカの半導体素子標準規格を策定する団体・JEDECが、ノートパソコン用メモリモジュールの新しい規格となるCompression ...
DRAMのメモリモジュール規格「DIMM」に代わる「CAMM」が採用され始めている。CAMMはDIMMとは何が違うのか。メモリモジュール進化の変遷を踏まえて解説する。 DIMMがまだ新しい技術に取って代わられていないのは、少々驚きだ。DIMMは、コンピュータ会社Wang ...
ARLINGTON, Va., October 20, 2025--(BUSINESS WIRE)--JEDEC® Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced it is ...
Micron Technology has started customer sampling of its new 192GB SOCAMM2 (Small Outline Compression Attached Memory Module), a low-power DRAM module designed for AI data centers. Save my User ID and ...
JEDEC® Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced it is nearing completion of JESD328: LPDDR5/5X Small Outline ...
Korea JoongAng Daily on MSN
Samsung-Nvidia, SK hynix-Intel partnerships open new fronts in chip rivalry
Samsung Electronics and SK hynix are ramping up their rivalry in low-power server memory by partnering with U.S. chip titans ...
JEDEC, an organization that formulates semiconductor device standards in the United States, has announced that it will standardize Compression Attached Memory Module (CAMM2), a new standard for memory ...
ARLINGTON, Va., October 14, 2025--(BUSINESS WIRE)--JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, has published the annual ...
ARLINGTON, Va.--(BUSINESS WIRE)--JEDEC® Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced it is nearing completion of ...
Yonhap News Agency on MSN
Samsung Electronics develops low-power server memory for AI data centers
Samsung Electronics Co. said Thursday it has developed low-power server memory solutions capable of supporting continuous ...
Samsung Electronics is seeking to regain its leadership in the memory market with its latest low-power server memory module, ...
JEDEC is nearing completion of a standard for low-profile LPDRAM modules developed specifically for data centre AI applications, it reports. It is the JESD328: LPDDR5/5X Small Outline Compression ...
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