SK hynix showcases its next-gen memory solutions for AI at CES 2026: with 48GB HBM4, SOCAMM, LPDDR6, and more for future AI ...

Innodisk, a leading global AI solution provider, announced the launch of its new AI on Dragonwing computing series, developed ...

Samsung last month unveiled a SOCAMM2 LPDDR5-based memory module designed specifically for AI data center platforms.

We are all familiar enough by now with the succession of boards that have come from Raspberry Pi in Cambridge over the years, ...

Virtium, a trusted designer and manufacturer of industrial-grade memory, storage, and Edge AI solutions, today announced the launch of its new "Made in the USA" AI Accelerator Module, VMX-004, a ...

Core Ultra 7 365 ：8コア（P-core×4，LP E-core×4），8スレッド，P-core定格クロック 1.8GHz，P-coreブースト最大クロック 4.8GHz，L3キャッシュメモリ容量 12MB，Intel ...

New nRF54L Series SoC with NPU and Nordic Edge AI Lab make on-device intelligence easily accessible and radically ...

Weighing less than three pounds and featuring a first-of-its-kind vapor chamber, HP's latest flagship ultraportable matches ...

AAEON BOXER-8742AI is a fanless Edge AI embedded system powered by an NVIDIA Jetson T4000 that was unveiled along with the ...

HP is delivering a different kind of all-in-one with the EliteBoard G1a, featuring a unique 'cyberdeck'-like design.

2026年はスマートフォンやPC、家電製品の価格が最大20％上昇する可能性があると経済紙のフィナンシャル・タイムズが報じました。これはAI需要の爆発的な増加に伴うもので、半導体メーカーはAIデータセンターなどで使われる高帯域幅メモリチップの製造に注力 ...