As a designer of High Frequency Radio equipment for over 40 years, I found difficulties in sufficiently isolating one stage of a radio system from another, this can cause interference between adjacent ...

More power in the same footprint is the constant request of the power industry’s customers. This challenge has hit a fever pitch as digital semiconductor packaging technology has increased performance ...

Although component-based design opens the door to many benefits, the separation that occurs in development projects can create its own challenges, writes Paul Allen. Almost all software designs ...

Abstract: It is thought that the component-based software engineering can not be used in the embedded systems. This thought is the result of the features of embedded systems. Embedded systems have ...

マイクロソフトは、4月末の米国でのWindows Embedded Standard 7のRTM版の発表を受けて、日本でも記者向け説明会を7日に開催した。 Windows Embedde Standard 7（Embedded 7）は、昨年9月には開発者向けのCTP版が「Windows Embedded Standard 2011」として発表されていたものだが、その ...

Embedded die packaging is seeing renewed demand amid the push towards chips and systems that require smaller form factors. ASE, AT&S, GE, Shinko, Taiyo Yuden, TDK, Würth Elektronik and others compete ...

Through-hole assembly means bending leads on components and putting the leads through holes in the circuit board, then soldering them in place, and trimming the wires. That took up too much space and ...

Altium has launched a new design vault based concept for managing component data at embedded world. According to the company, the 'unified component' model extends traditional design libraries to ...

マイクロソフト(株)は19日、組み込みでバイス開発者向けカンファレンス“The Windows Embedded Developers Conference 2002 Japan”を都内ホテルで開催し、次世代組み込み向けOS『Microsoft Windows XP Embedded マルチユーザーインターフェース版』、および『Microsoft Windows CE.NET ...