オーデスクは4月6日、「Autodesk Moldflow」や「Autodesk CFD」などの製造業向け解析アプリケーションの最新バージョンを発売した。 「Autodesk Moldflow Adviser 2017」「Autodesk Moldflow Insight 2017」「Autodesk Moldflow Synergey 2017」「Autodesk Simulation ...

オートデスク株式会社は、製造業向けシミュレーション アプリケーションの新バージョンを4月6日から発売します。 ・マッピング機能を改良して、射出から圧縮成形、全要素、中立面シェルへのマッピング、残留ひずみのマッピングなどが可能に（Helius PFA ...

Moldflow Plastics Insight (MPI) version 6.0 incorporates many new features and enhancements that save time, improve communications amongst distributed product design teams and allow better interaction ...

FRAMINGHAM, Mass.--(BUSINESS WIRE)--Moldflow Corporation (NASDAQ: MFLO), the leading provider of plastics simulation software that empowers more users to optimize more designs across their enterprise, ...

Abstract: The microelectronics products of Flip Chip-Chip Scale Package (FCCSP) with more increasing challenges are faced to assure molding capability with rapid advances in flip chip technology such ...

射出成形・鋳造：強度も合わせて解析、設計での利用進む 射出成形のシミュレーション（一覧表[4]）については、製品軽量化のため樹脂の利用が拡大するにつれて、使い方が若干変化している。ショートショット（樹脂が金型内に十分に行き渡らず欠損 ...

Moldflow Corporation (Framingham, MA) released Moldflow Structural Alliance (MSA) 1.1, which will allow users of ABAQUS and ANSYS to improve the accuracy of the analysis of assemblies that contain ...

Synventive Molding Solutions Inc., a maker of hot-runner systems, and simulation-software producer Moldflow Corp. of Wayland, Mass., have agreed to collaborate on new products. The companies plan to ...

INDIANAPOLIS (Sept. 23, 9 a.m. EDT) — Synventive Molding Solutions Inc., a maker of hot-runner systems, and simulation-software producer Moldflow Corp. of Wayland, Mass., have agreed to collaborate on ...

Abstract: Currently electrical products such as smart phone and tablet, light weight and thin feature of them are definitely required. To achieve several requirements, size of IC package assembled in ...