Abstract: The thermo-mechanical reliability of high-power IGBT modules is strongly connected with the thermal resistance between the transistors and the heat sink which is directly influenced by a ...
Abstract: This paper presents an improved thermal network model of insulated-gate bipolar transistor (IGBT) module, which considers the effects of base-plate solder fatigue on the junction temperature ...
A lack of planarity along the interface between the solder and the ceramic raft in an IGBT module is a common anomaly that can make heat dissipation uneven across the die and cause the die to crack.
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