More power in the same footprint is the constant request of the power industry’s customers. This challenge has hit a fever pitch as digital semiconductor packaging technology has increased performance ...

Brian Narveson, Independent Consultant and PSMA Board Member, and Greg Evans, CEO, WelComm Inc., and PSMA Marketing Committee, contributed to this article. It’s always been inevitable, that in system ...

The Power Sources Manufacturers Association (PSMA) Packaging Committee is sponsoring an Industry Session at APEC 2015 titled, "Substrate Embedded Components Enabling High Density 3D Power Packaging." ...

New York, Dec. 29, 2020 (GLOBE NEWSWIRE) -- Reportlinker.com announces the release of the report "Embedded Die Packaging Market - Growth, Trends, Forecasts (2020 ...

AT&S is the leading provider for Embedded Component Packaging Solutions. Its patented ECP® technology enables further miniaturisation while improving performance. Due to its constant technology ...

Customers are pushing for increasing power per board and implementing ever more silicon on the PCB with the result that increasing processing density in high-end server designs will continue to have ...

WILSONVILLE, Ore.--(BUSINESS WIRE)--Mentor Graphics Corporation (NASDAQ: MENT), the market and technology leader in printed circuit board (PCB) design solutions, today announced the technology ...