Abstract: We have developed a new chip capacitor embedded interposer using a narrow gap chip parts mounting technology. This interposer is expected to reduce power distribution network (PDN) impedance ...

Murata has introduced the GRU series, the world’s thinnest embedded monolithic capacitor for substrates. Using advanced ceramic technology, the new 0402 size capacitor, measuring only 1.0mm x 0.5mm x ...

Scientists at Tokyo Institute of Technology develop a 3D functional interposer--the interface between a chip and the package substrate--containing an embedded capacitor. This compact design saves a ...

Abstract: We evaluated low-impedance power distribution network (PDN) of decoupling capacitor embedded interposers for 3-D integrated LSI system. Measurements are carried out using the developed ...

Murata has introduced the GRU series, said to be the world's thinnest embedded monolithic capacitor for substrates. Using advanced ceramic technology, the 0402 size device, measuring 1 x 0.5 x 0.15mm, ...

But if you eliminate the capacitor, where is the charge that represents the data bit stored? That's the magic of SOI. The active circuit layer is isolated from the substrate, so there's a capacitive ...

Murata Electronics North America has introduced the GRU series, the world's thinnest embedded monolithic capacitor for substrates. Using advanced ceramic technology, the new 0402 size capacitor, ...

To push access times toward those of SRAM while achieving much higher densities, embedded DRAM needs a structure that differs from both commodity DRAM and conventional embedded DRAM. The challenge is ...