Electroplating is a technique that uses an electrical current to deposit a thin layer of metal onto a surface. It is widely used across industries to enhance material properties, such as durability, ...

Abstract: In the flip-chip interconnection technology, Cu–Cu bonding is one of the key technologies. Currently, the industry commonly uses hot-press bonding to achieve high-density Cu–Cu ...

Historically, electroplating has been used to add a thin layer of a precious metal—typically gold—to an electrical connector to improve corrosion resistance. However, recent collaborations between ...

Electroplating intermediates refer to a class of fine chemicals used as electroplating additives. Unlike the salt used in the plating production process, the electroplating intermediate is an additive ...

Abstract: Accelerator consumption was analyzed by electrochemical method. As the presence of SPS and PEG in the acidic cupric sulfate solution with chloride ions, the cathodic polarization curves ...