The growing volume of products requiring copper interconnects necessitates a high productivity electrofill. Novellus researchers describe new chemistries The transition to smaller copper interconnect ...

Abstract: A void-free copper electroplating method on copper column based solder bump for flip-chip interconnection enabling reduction of the copper column void defects in the solder bump was ...

Creative Commons (CC): This is a Creative Commons license. Attribution (BY): Credit must be given to the creator. Acid copper electroplating stands as a core technology in advanced packaging processes ...

While researching copper plating graphite for a project, [Dave] stumbled upon a blog post illustrating a brilliant approach to metal plating 3D printed parts. Our pioneers in this new technique are ...

Abstract: The electroplating of copper in high-aspect-ratio trenches and vias is a difficult challenge facing the new technology of copper on-chip interconnect. Super filling or bottom-up filling is ...

Researchers have developed the incredible ability to 3D print copper at atomic scales. A team of researchers from several institutions has been working on the new 3D printing process, which uses the ...

This masterclass will explore the principles of electrochemistry through the process of electroplating. Together with the students, we will perform copper electroplating on 3D-printed miniatures (e.g.