Abstract: This work presents a dual-band coil module for near-field resonant wireless power transfer (WPT). It provides additional channel either for more power transfer or higher data transmission.

Neubiberg, Germany – January 29, 2013 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a worldwide leading manufacturer of semiconductor solutions for payment applications, today introduced its ...

Infineon is expanding its CoM (Coil on Module) portfolio for secure contactless ID documents. The new SLC52 security chip is now available, integrated with the card antenna into a polycarbonate ...

Abstract: A multi-band wireless power transfer (WPT) will be one of the important WPT research trends in the future. This work presents a single-coil dual-band WPT coil module as an example in the ...

Infineon Technologies AG today announced the availability of its "Coil on Module" (CoM) package technology for official documents. The technology simplifies and improves manufacturing of electronic ...

Infineon, a manufacturer of semiconductor solutions for payment applications, introduced its Coil on Module chip package to support global distribution of dual interface bank and credit cards. The new ...