Traditional high downforce (>2.0psi, 14kPa) chemical mechanical planarisation (CMP) processes face challenges when used to polish copper with low-k films in damascene interconnect structures.

The semiconductor industry is constantly marching toward thinner films and complex geometries with smaller dimensions, as well as newer materials. The number of chemical mechanical planarization (CMP) ...

For decades, semiconductor manufacturers have used chemical-mechanical polishing (CMP) as the primary technique for the smoothing and leveling (planarization) of dielectrics and metal layers. CMP ...

Abstract: The with-in-wafer uniformity and geometry of the CMP process varies across the life of consumables. The pre layer geometry and thickness significantly affect the post CMP process uniformity ...

To allow real-time control of dielectric chemical mechanical planarization (CMP) processes to the 45 nm device node and beyond, Santa Clara, Calif.-based semiconductor manufacturing equipment leader ...

The following column was provided by Drew Chambers, product manager for Rodel Inc., a Phoenix-based supplier of polishing pads for chemical mechanical planarization (CMP) applications. Chemical ...

Abstract: Based on close observation of the delamination behavior of low-k films characterized by extremely weak adhesion, we found through experiments and simulations that the delamination is not ...

A potential method for future cost reductions in SiC processing involves the use of plasma polishing SiC wafers before epi growth as a replacement to the traditional CMP process. The crystal growth of ...

ACM Research, a supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, has announced the introduction of its new post-CMP cleaning tool. This ...