Smooth and straight connections must be created at PCB (Printed Circuit Board) layout. BGA pins may need to be re-assigned, if the BGA is re-configurable, but that's necessary to keep signals and ...

ボール - グリッド - アレイ（BGA）技術は、コンパクトかつ高性能な回路設計を可能にし、現代の電子製品に革新をもたらしました。デバイスの小型化と高機能化が進む中、BGAパッケージはプリント基板（PCB）上に集積回路（IC）を実装するための主要な ...

The Ball Grid Array, or BGA package is no longer the exclusive preserve of large, complex chips on computer motherboards: today even simple microcontrollers are available with those little solder ...

In some designs where electro-magnetic interference (EMI) is a concern, the external layer or top layers aren’t used to route even the outer periphery. In that case the top layer is used for a ground ...